Electro-deposited Copper Foil
- Electro-deposited Copper Foil
 
We have a variety of electrodeposited copper foil products that are used for rigid, rigid-flex, flexible, high density, fine-line applications. Foil thickness ranging from 9µm (Qoz.) to 35µm (1oz.) are available that conform to the latest version of IPC-4562A.
ED Product Lineup
                        
                        Low Profile Electrodeposited Copper Foils
JTCLC / JTCSLC (JXLP-I / JXLP-II)
- Grade 1 and Grade 3 Copper foil for fine line patterning.
 - An etchability improved type of foil from JX-NMMC, bearing the following features:
 
                                1. Finer nodules: Finer etchability by less roughness 
2. Larger surface area: Comparable board properties to conventional foil (JTCS)
3. Arsenic-free: Environmental-friendly
                            
                        2. Larger surface area: Comparable board properties to conventional foil (JTCS)
3. Arsenic-free: Environmental-friendly
JDLC (JXLP-III)
- Grade 1 STD Copper foil best suited for fine line application with excellent chemical resistance.
 - Similar with JTCLC/JTCSLC, JDLC is also an etchability-improved type of foil from JX-NMMC.
 - It is best suitable for fine line application where peel reliability is strictly required.
 
HLPLC (JXHLP-I) / JXHLP-II
- Double-side flat foil with fine and ultra-fine nodulation applicable to applications where finer lines are required.
 - The JXHLP-II is also Arsenic-free (environment friendly) with ultra low transmission loss.
 - Shows an extreme level of flatness due to the both sides flatness of base foil and finer and more uniform nodular treatment.
 - A combination of both-side flat base foil and fine nodular treatment enables excellent performance in high frequency transmission properties.
 
JXEFL
- JX’s Electrodeposited Copper Foil for FLex PCB.
 - Apply JX’s RA copper foil technology to ED copper foil.
 - Annealable base foil + fine nodule reverse treatment.
 - Has peel strength same as JX RA “BHY” which is the standard foil for FPC.
 - Although RA foils are known to provide optimum flexible performance, JXEFL copper foil has sufficient bendability for flexible applications, reasonable in cost and sufficient bonded strength.
 - Arsenic-free.
 
            